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LT3591
PACKAGE DESCRIPTION
DDB Package
8-Lead Plastic DFN (3mm × 2mm)
(Reference LTC DWG # 05-08-1702 Rev B)
0.61 ± 0.05
(2 SIDES)
0.70 ± 0.05
2.55 ± 0.05
1.15 ± 0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
2.20 ± 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1 BAR
TOP MARK
3.00 ± 0.10
(2 SIDES)
2.00 ± 0.10
(2 SIDES)
R = 0.05
TYP
R = 0.115
TYP
5
8
0.40 ± 0.10
PIN 1
R = 0.20 OR
(SEE NOTE 6)
0.200 REF
0.75 ± 0.05
0.56 ± 0.05
(2 SIDES)
4
0.25 ± 0.05
1
0.50 BSC
0.25 × 45 °
CHAMFER
(DDB8) DFN 0905 REV B
2.15 ± 0.05
0 – 0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
3591f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
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